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BAE Systems Sr. Mechanical Engineer - Microelectronics Packaging in Cedar Rapids, Iowa

Job Description

BAE Systems is looking for a Senior Mechanical Engineer with a passion for engineering and the desire to work in the world of Microelectronics. Our team needs engineers interested in designing and developing the Microelectronic Packages needed for Global Positioning Systems (GPS) products. This position offers abundant opportunity to design and develop state of the art miniaturized electronic devices. As a part of this team, you will have responsibilities spanning all phases of the engineering life cycle including design, process development, qualification and factory support. The successful applicant should be knowledgeable in Microelectronics Packaging design or materials.

Primary Responsibilities:

  • Contribute to program pursuits and bid estimates

  • Participate in Microelectronics product development activities including packaging concepts, preliminary/detailed board design and package road mapping efforts

  • Develop technologies required for next generation packages

  • Coordinate prototype package builds and evaluation efforts

  • Qualify microelectronic packages

  • Conduct failure analysis for microelectronic packages

  • Support factory transition of products

  • Provide manufacturing support for Microelectronic assemblies currently in production

Required Education, Experience, & Skills

  • US Citizenship

  • All applicants must be able to obtain a DoD Security Clearance at time of application (REQUIRED)

  • Bachelor's degree in Mechanical Engineering, Material Engineering or Chemical Engineering with 4 years of direct related experience.

Preferred Education, Experience, & Skills

  • Microelectronics design and manufacturing assembly

  • Microelectronic packaging materials and material properties

  • Electronic component reliability testing

  • Post wafer fabrication processes

  • Failure analysis techniques

  • Additive Manufacturing

Sr. Mechanical Engineer - Microelectronics Packaging


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