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Meta Silicon Package Development Engineer in Des Moines, Iowa

Summary:

Meta Reality Labs focuses on delivering Meta's vision through Augmented Reality (AR) and Virtual Reality (VR). The compute performance and power efficiency requirements of Virtual and Augmented Reality require custom silicon. Meta Silicon team is driving the state of the art forward with breakthrough work in computer vision, machine learning, mixed reality, graphics, displays, sensors, and new ways to map the human body. Our chips will enable AR and VR devices where our real and virtual world will mix and match throughout the day. We believe the only way to achieve our goals is to look at the entire stack, from transistor, through architecture, to firmware and algorithms. Join the adventure of a lifetime as we make science fiction real and change the world.We are seeking a Silicon Package Development Engineer to join our silicon team. We are building a competency in Packaging technology to support the development of custom Si for AR/VR hardware as well as to develop Packaging solutions that are optimal for our device ID and system level performance.

Required Skills:

Silicon Package Development Engineer Responsibilities:

  1. Develop and qualify packaging for Meta's custom silicon with configurations ranging from single-chip, module, SiP and processor-memory integration as well as downstream board and system level assembly.

  2. Develop manufacturing specifications and qualification plans working with other stakeholders in Meta.

  3. Work closely with internal silicon, architecture and system teams and externally engaged partners, design houses and OSAT companies to develop package architecture, performance/reliability requirements and manufacturing specifications.

Minimum Qualifications:

Minimum Qualifications:

  1. Experience taking products from concept to production including development of manufacturing specifications, vendor qualifications and improvement of manufacturing efficiencies and costs.

  2. 5+ years experience in advanced Si package and SiP module development and manufacturing.

  3. Bachelors degree in materials science, mechanical engineering, electrical engineering or equivalent experience.

Preferred Qualifications:

Preferred Qualifications:

  1. Familiarity with package electrical fundamentals like SI-PI and PDN

  2. Masters degree in Electrical or Mechanical Engineering, Material Science or equivalent

  3. Familiarity with advanced SiP module design, development and manufacturing

  4. Familiarity with FEM modeling of package thermal and mechanical behavior

  5. Familiarity with risk assessment and mitigation methodologies like FMEA and DFM

Industry: Internet

Equal Opportunity: Facebook is proud to be an Equal Opportunity and Affirmative Action employer. We do not discriminate based upon race, religion, color, national origin, sex (including pregnancy, childbirth, or related medical conditions), sexual orientation, gender, gender identity, gender expression, transgender status, sexual stereotypes, age, status as a protected veteran, status as an individual with a disability, or other applicable legally protected characteristics. We also consider qualified applicants with criminal histories, consistent with applicable federal, state and local law. Facebook is committed to providing reasonable accommodations for candidates with disabilities in our recruiting process. If you need any assistance or accommodations due to a disability, please let us know at accommodations-ext@fb.com.

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